Compare the market without the marketing fog.
A curated navigation layer for real manufacturer families. Use this page to find official product resources; use the manufacturer datasheet as the source of truth for final selection.
| Device family | Manufacturer | Voltage | Architecture | Application signals | Official |
|---|---|---|---|---|---|
| Infineon CoolMOS 8 | Infineon | 600/650 V | SJ MOSFET | Server PSU, telecom, EV charging | Product source ↗ |
| ST MDmesh M9 / MDmesh families | STMicroelectronics | 250–650 V class | SJ MOSFET | High-power-density SMPS, resonant conversion | Product source ↗ |
| Toshiba DTMOS VI | Toshiba | 650 V class | SJ MOSFET | Data center, PV, UPS | Product source ↗ |
| ROHM R60xxXNx / WNx | ROHM | 600 V class | SJ MOSFET | AI server PSU, industrial | Product source ↗ |
| Vishay EF Series | Vishay | 500–650 V class | SJ MOSFET | Power conversion | Product source ↗ |
| Nexperia NextPower S3 | Nexperia | 25–40 V class | Low-voltage SJ | Servers, telecom, ORing, motor control | Product source ↗ |
| Fuji Super J-MOS | Fuji Electric | 600 V class examples | SJ MOSFET | PFC, PWM, server/UPS | Product source ↗ |
Do not select on RDS(on) alone.
For a real converter, build the comparison around operating conditions.
1. Voltage margin
Compare maximum repetitive VDS against DC bus, transients and layout-induced overshoot.
2. Current & temperature
Use hot RDS(on), junction temperature and package thermal resistance—not room-temperature headline values.
3. Switching energy
Examine Eon/Eoff, Qg, Qgd, Qoss/Eoss and the actual gate-drive network.
4. Diode behavior
For bridges, study Qrr, trr, softness and commutation conditions.
5. Package parasitics
Lead inductance, Kelvin source options, thermal path and creepage can dominate at high di/dt and dv/dt.
6. Qualification
Automotive, industrial and consumer qualification requirements are not interchangeable.